UHV Sputter Source: CUSP

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Cusp

UHV Sputter Source: CUSP
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Product Description

The CUSP series magnetron sputter sources are designed for high- rate deposition with efficient target utilisation. All Sources are equipped as standard with integral gas feed allowing a higher local pressure to exist immediately above the sputter target than in the surrounding chamber with the consequence that the source can be operated at lower overall chamber pressure.

In addition to standard models we offer linear sources, magnetrons mounted on linear Z-shift and magnetrons with in-situ tilt.

Specifications

  • Mounting flange
  • In-vacuum length (mm)
  • In-vacuum diameter

  • Target Diameter
  • Max Target Thickness
  • Cooling

Cusp-1i

  • NW63CF
  • 150min 400max
  • 60

  • 1(25mm)
  • 4mm
  • Water

Cusp-2i

  • NW63CF
  • 150min 400max
  • 70(no gas hood)
    93(with gas hood)
  • 2(50mm)
  • 6mm
  • Water

Cusp-3i

  • NW100CF
  • 150min 400max
  • 96

  • 3(75mm)
  • 6mm
  • Water
2015 SG Instuments
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